Semiconductor device with equipotential ring contact at curved portion of equipotential ring electrode and method of manufacturing the same

ABSTRACT

A downsized semiconductor device having an excellent reverse characteristic, and a method of manufacturing the semiconductor device is sought to improve. The semiconductor device comprises a semiconductor body having a polygonal contour. An active area is formed in the semiconductor body. An EQR electrode is formed so as to surround the active area and to have curved portions of the EQR electrode along the corners of the semiconductor body. An interlayer insulating film is formed to cover the active area and the EQR electrode. The EQR electrode is embedded in the interlayer insulating film around the active area. EQR contacts are in contact with the curved portions of the EQR electrode and the semiconductor body outside the curved portions, and have at least side walls covered with the interlayer insulating film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.13/164,866, filed on Jun. 21, 2011, which claims priority from Japanesepatent application No. 2010-149510 filed on Jun. 30, 2010, the contentsof all of which are incorporated herein by reference in their entirety.

BACKGROUND

The present invention relates to a semiconductor device and a method ofmanufacturing the same, and more particularly to a semiconductor deviceexcellent in reverse characteristic and a method of manufacturing thesame.

In recent years, the use of a high voltage semiconductor element hasbeen advanced. In general, in the high voltage semiconductor element, aring-shaped EQR (equi-potential ring) electrode is formed to surround anactive area in which cells are arrayed is formed. If a drain potentialof the EQR electrode is kept, expansion of a depletion layer toward theoutside of the cell area is suppressed. A mechanism in which theexpansion of the depletion layer is suppressed is generally called“channel stopper mechanism”. The channel stopper mechanism is essentialin obtaining an excellent reverse characteristic.

In a related-art high voltage semiconductor element, the EQR electrodeincludes two portions including a portion where the EQR electrode isformed on an interlayer insulating film, and a portion where the EQRelectrode is embedded in the interlayer insulating film. Those twoportions are electrically coupled to each other (Japanese Patent No.3376209 and Japanese Patent No. 3440987). Also, there is a semiconductorelement having a configuration in which the above two EQR electrodes areintegrated together (Japanese Patent No. 4059566). Similarly, in thissemiconductor element, a part of the EQR electrode is exposed to theinterlayer insulating film.

A general high voltage semiconductor device will be described below.FIG. 13 is a plan view illustrating a configuration of a general highvoltage semiconductor device 500. The semiconductor device 500 is of arectangular contour, and has an active area 51 arranged in the centerthereof. Cells such as MOSFETs (metal oxide semiconductor field effecttransistor) are arranged in the active area 51. The active area 51 iscovered with source electrodes (not shown) electrically coupled with therespective cells.

A ring-shaped second gate electrode 76 is formed apart from the activearea 51 in an outer periphery of the active area 51. The second gateelectrode 76 is electrically coupled to a first gate electrode 66 thatwill be described later. A ring-shaped second EQR electrode 73 is formedapart from the second gate electrode 76 in an outer periphery of thesecond gate electrode 76.

Subsequently, a cross-sectional structure of the semiconductor device500 will be described. FIG. 14 is a cross-sectional view of the generalhigh voltage semiconductor device 500 taken along a line XIV-XIV in FIG.13. The semiconductor device 500 is sectioned into the active area 51and a channel stopper area 52. In the semiconductor device 500, an n⁻type epitaxial layer 62 is formed over an n⁺ type semiconductorsubstrate 61. A drain electrode 69 is formed on a rear surface side ofthe semiconductor substrate 61.

In the active area 51, a p type base diffusion region 63 is formed in anupper portion of the epitaxial layer 62. On a part of an upper surfaceside of the base diffusion region 63 are formed an n⁺ type sourcediffusion region 64. A first gate electrode 66 is so formed as to applya voltage to the base diffusion region 63 through a gate oxide film 65.An interlayer insulating film 67 is formed over the first gate electrode66. A source electrode 68 that covers the active area 51 is electricallycoupled to the source diffusion region 64.

In the channel stopper area 52, the base diffusion region 63 is formedin an upper portion of the epitaxial layer 62. An n⁺ type channelstopper layer 71 is formed on a part of an upper surface side of thebase diffusion region 63. The channel stopper layer 71 is the same layeras that of the source diffusion region 64. The gate oxide film 65 isformed over the base diffusion region 63 and the epitaxial layer 62where the channel stopper layer 71 is not formed. A first EQR electrode72 is formed over the gate oxide film 65. The first EQR electrode 72 iscovered with the interlayer insulating film 67. An opening portion isformed in a part of the interlayer insulating film 67, and an uppersurface of the first EQR electrode 72 is exposed. The second EQRelectrode 73, which is electrically coupled to the exposed first EQRelectrode 72, is formed over the interlayer insulating film 67 and thechannel stopper layer 71.

In an area between the active area 51 and the channel stopper area 52, afield oxide film 74 is formed over the epitaxial layer 62. The fieldoxide film 74 is covered with the interlayer insulating film 67. Anopening portion is formed in the interlayer insulating film 67 formedover the first gate electrode 66 extending from the active area 51. Thesecond gate electrode 76 is so formed as to be electrically coupled tothe first gate electrode 66 through the opening portion.

In the semiconductor device 500, when a reverse bias is applied betweenthe source electrode 68 and the drain electrode 69, a depletion layerindicated by a broken line L1 expands toward the channel stopper area 52from the active area 51.

On the other hand, in the channel stopper area 52, the channel stopperlayer 71, the first EQR electrode 72, and the second EQR electrode 73are electrically coupled to each other. Also, an end surface 75 of FIG.14 is a surface formed by dicing and having a large number of defects.For that reason, the end surface 75 has an electrical conductivity. Withthis configuration, the channel stopper layer 71 and the drain electrode69 are electrically connected to each other through the end surface 75.As a result, the first EQR electrode 72 is equipotential to the drainelectrode 69.

When the first EQR electrode 72 is held to the drain potential, aninversion layer indicated by a broken line L2 is formed in the epitaxiallayer 62 through the gate oxide film 65 formed below the first EQRelectrode 72. With this configuration, a channel stopper structure isformed to stop an electric force line extending from the active area 51.As a result, in a voltage-current waveform, a hard breakdown shape(excellent reverse characteristic) is obtained.

Also, as another important characteristic of the high voltagesemiconductor element, there are an on-resistance and a breakdownwithstand voltage. The on-resistance mainly depends on a resistivity ofthe epitaxial layer, and can be reduced by increasing an impurityconcentration in the epitaxial layer. However, when the impurityconcentration of the epitaxial layer 62 increases, the breakdownwithstand voltage decreases. That is, the on-resistance and thebreakdown withstand voltage have a relationship of tradeoff. In order toavoid an influence of the tradeoff relationship, a cell shrink isapplied to increase an on-state current per unit area so that areduction in the on-resistance is realized.

On the other hand, there is a demand to reduce the on-resistance withthe same chip size. To meet this demand, an attempt is made to enlarge acell area (an area in which an element such as a transistor is formed).As one attempt, a method of reducing the channel stopper area has beenproposed (Japanese Patent Application Publication No. 2008-270440).

Also, a technique in which a withstand voltage area (corresponding tothe channel stopper area) is reduced with the use of a dead space of thesemiconductor element has been proposed (Japanese Patent ApplicationPublication No. 2008-193043). In this technique, a plurality ofring-shaped guard rings is formed over the semiconductor substratearound an active area. A ring-shaped first field plate having electricconductivity is formed over the guard ring. A second field plate formedof a metal film is formed over the guard ring. The second field plate isexposed to the interlayer insulating film. The second field plate isarranged on a portion of each corner of the semiconductor element inwhich the guard ring and the first field plate are curved. Since eachcorner of the semiconductor element is originally a dead space, thesecond field plate is arranged on the corner so that the width of thewithstand voltage area can be narrowed, and the area of the active areacan increase. Japanese Patent Application Publication No.Hei5(1993)-19010 and Japanese Patent No. 3417336 will be describedlater.

SUMMARY

In the above-mentioned semiconductor device, the active area is coveredwith the source electrode, and the ring-shaped gate electrode and EQRelectrode are formed around the active area at given intervals. The gateelectrode and the EQR electrode are covered with an insulating filmoften called “cover film”. Further, in packaging in a post-process, aresin is deposited on the cover film. In general, a thickness of thecover film is thin as compared with respective distances among thesource electrode, the gate electrode, and the EQR electrode. For thatreason, the resin gets into spaces among the respective electrodes.

Under the above circumstances, when a temperature cycle test isconducted, a stress is applied to a surface side of the semiconductordevice due to a difference in the thermal expansion coefficient betweenthe semiconductor device per se and the resin. For that reason, therespective electrodes are pressed and stretched, resulting indisplacement or peeling off of the electrodes. If the electrodes aremade of aluminum, an influence of a thermal stress on the electricperformances of the electrodes, such as aluminum slide (displacement ofthe electrodes), short-circuit of the adjacent electrodes, or theoccurrence of disconnection, has been known (Japanese Patent ApplicationPublication No. Hei 5(1993)-19010). There has been known that theinfluence of the thermal stress due to the resin is large at the cornersof the semiconductor device. In order to solve this problem, forexample, a technique in which an electrode is formed in an area otherthan the corners has been proposed (Japanese Patent No. 3417336).

That is, for example, as disclosed in Japanese Patent ApplicationPublication No. 2008-193043, when the electrode is formed at the cornersof the semiconductor device, the semiconductor device becomes brittledue to the influence of the thermal stress. Accordingly, up to now, thesemiconductor device using the dead space while keeping the excellentreverse characteristic cannot be downsized.

According to one aspect of the present invention, there is provided asemiconductor device comprising: a semiconductor body that has apolygonal shape and has an active area including transistor elementsformed therein; an insulating film that is formed over the semiconductorbody; an EQR electrode that is embedded in the insulating film aroundthe active area, and includes curved portions at corners of thepolygonal shape; a source contact that is formed within the insulatingfilm in the active area; and an EQR contact that is formed within theinsulating film so as to contact the curved portions of the EQRelectrode and the semiconductor body outside the curved portions.

In the semiconductor device, an upper surface of the EQR contact islower in level than an upper surface of the insulating film and an uppersurface of the source contact.

According to another aspect of the present invention, there is provideda method of manufacturing a semiconductor device which comprises anactive area formed in a semiconductor body, the semiconductor bodyhaving a polygonal contour. The method, comprising: forming an EQRelectrode over the semiconductor body so as to surround the active area,the EQR electrode having curved portions at corners of the polygonalcontour; forming an insulating film that covers the semiconductor bodyand the EQR electrode; removing a part of the insulating film, andforming a source contact hole in the active area from which thesemiconductor body is exposed, and EQR contact holes in the curvedportions of the EQR electrode from which the EQR electrode and thesemiconductor body outside the EQR electrode are exposed, at the sametime, in which each of the EQR contact holes has an opening larger thanthat of the source contact hole; depositing a conductive material on theinsulating film and within the source contact hole and the EQR contactholes; and etching the conductive material until an upper surface of theinsulating film is exposed, forming a source contact and EQR contacts atthe same time, in which an upper surface of the EQR contacts is lower inlevel than an upper surface of the insulating film and an upper surfaceof the source contact.

According to the present invention, a downsized semiconductor devicehaving an excellent reverse characteristic, and a method ofmanufacturing the semiconductor device can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating a structure of a semiconductor deviceaccording to a first embodiment;

FIG. 2 is an enlarged plan view illustrating a corner of thesemiconductor device according to the first embodiment;

FIG. 3 is a cross-sectional view illustrating the semiconductor devicetaken along a line III-III in FIG. 1 according to the first embodiment;

FIG. 4 is a plan view illustrating a structure of a semiconductor deviceaccording to a second embodiment;

FIG. 5 is an enlarged plan view illustrating a corner of thesemiconductor device according to the second embodiment;

FIG. 6 is a plan view illustrating a structure of a semiconductor deviceaccording to a third embodiment;

FIG. 7 is an enlarged plan view illustrating a corner of thesemiconductor device according to the third embodiment;

FIG. 8 is a cross-sectional view illustrating the semiconductor devicetaken along a line VIII-VIII in FIG. 6 according to the thirdembodiment;

FIG. 9 is a cross-sectional view illustrating an active area of thesemiconductor device according to the third embodiment;

FIG. 10A1 and FIG. 10A2 are a cross-sectional view illustrating aprocess of manufacturing the semiconductor device according to the thirdembodiment;

FIG. 10B1 and FIG. 10B2 are a cross-sectional view illustrating aprocess of manufacturing the semiconductor device according to the thirdembodiment;

FIG. 10C1 and FIG. 10C2 are a cross-sectional view illustrating aprocess of manufacturing the semiconductor device according to the thirdembodiment;

FIG. 10D1 and FIG. 10D2 are a cross-sectional view illustrating aprocess of manufacturing the semiconductor device according to the thirdembodiment;

FIG. 10E1 and FIG. 10E2 are a cross-sectional view illustrating aprocess of manufacturing the semiconductor device according to the thirdembodiment;

FIG. 11 is a plan view illustrating a structure of a semiconductordevice according to a fourth embodiment;

FIG. 12 is an enlarged plan view illustrating a corner of thesemiconductor device according to the fourth embodiment;

FIG. 13 is a plan view illustrating a configuration of a general highvoltage semiconductor device; and

FIG. 14 is a cross-sectional view illustrating the general high voltagesemiconductor device taken along a line XIV-XIV in FIG. 13.

DETAILED DESCRIPTION

First Embodiment

Embodiments of the present invention will be described below withreference to the accompanying drawings. First, a semiconductor deviceaccording to a first embodiment will be described. FIG. 1 is a plan viewillustrating a structure of a semiconductor device 100 according to afirst embodiment. A semiconductor device 100 has a rectangular contourand has an active area 21 arranged in the center thereof. The activearea 21 has, for example, cells such as MOSFETs or IGBTs (insulated gatebipolar transistor) arranged therein. The active area 21 is covered witha source electrode (not shown) connected with the respective cells.

A second gate electrode 6 is so formed as to surround the active area21. The second gate electrode 6 is electrically coupled to a first gateelectrode 9 that will be described later. An EQR electrode 8 is formedto be apart from the second gate electrode 6, and surround the activearea 21 and the second gate electrode 6.

As described above, the semiconductor device 100 has a rectangularcontour. For that reason, the second gate electrode 6 and the EQRelectrode 8 are linearly shaped in areas along sides of thesemiconductor device 100. On the other hand, the second gate electrode 6and the EQR electrode 8 are curved along each corner 22 of thesemiconductor device 100. That is, each of the second gate electrode 6and the EQR electrode 8 has an annular shape in which linear portionsand curved portions are coupled to each other. As illustrated in FIG. 1,the second gate electrode 6 is formed with linear portions 6 a of thesecond gate electrode and curved portions 6 b of the second gateelectrode. The EQR electrode 8 is formed with linear portions 8 a and ofthe EQR electrode and curved portions 8 b of the EQR electrode.

FIG. 2 is an enlarged plan view illustrating the corner 22 of thesemiconductor device 100 according to the first embodiment. Asillustrated in FIGS. 1 and 2, each EQR contact 10 a is in contact withan outer side of each curved portion 8 b of the EQR electrode 8.

In FIGS. 1 and 2, the EQR electrode 8 and the EQR contacts 10 a arecovered with an interlayer insulating film 7 that will be describedlater. However, for description of the positions of the EQR electrode 8and the EQR contacts 10 a, the interlayer insulating film 7 is omittedfrom FIGS. 1 and 2.

Subsequently, a cross-sectional structure of the semiconductor device100 will be described. FIG. 3 is a cross-sectional view illustrating thesemiconductor device 100 taken along a line III-III in FIG. 1 accordingto the first embodiment. In the semiconductor device 100, an epitaxiallayer 2 is formed over a semiconductor layer 1. The semiconductor layer1 is made of, for example, n type silicon substrate. The epitaxial layer2 is made of, for example, n type silicon layer. A base diffusion region3 is formed in a part of the epitaxial layer 2. The base diffusionregion 3 is made of, for example, p type silicon diffusion region. Ahigh concentration diffusion region 12 is formed in a part of the basediffusion region 3. The high concentration diffusion region 12 is madeof, for example, p⁺ type silicon diffusion region. A drain electrode 5is formed on a rear surface side of the semiconductor layer 1.

The interlayer insulating film 7 is formed over the epitaxial layer 2.The linear portions 8 a and curved portions 8 b of the EQR electrode(that is, the EQR electrode 8) and the first gate electrode 9 areembedded into the interlayer insulating film 7. The first gate electrode9 is coupled to a gate of each cell arrayed in the active area 21. TheEQR electrode 8 and the first gate electrode 9 are made of, for example,polysilicon layer.

An opening portion is formed in the interlayer insulating film 7 overthe first gate electrode 9. The linear portions 6 a and curved portions6 b of the second gate electrode (that is, the second gate electrode 6)extend from the opening portion over the interlayer insulating film 7.Hence, the first gate electrode 9 and the second gate electrode 6 areelectrically coupled to each other. The second gate electrode 6 is madeof, for example, aluminum layer.

Each EQR contact 10 a that electrically couples the EQR electrode 8 tothe high concentration diffusion region 12 is embedded in the interlayerinsulating film 7. The EQR contact 10 a is formed such as a tungstenplug. In an area extending from the EQR contact 10 a to an end surface16, a channel stopper layer 4 is formed between the base diffusionregion 3 and the interlayer insulating film 7. The channel stopper layer4 is made of, for example, n⁺ silicon diffusion layer. Although notshown, in packaging the semiconductor device 100, a resin is depositedon the interlayer insulating film 7.

The semiconductor layer 1, the epitaxial layer 2, the base diffusionregion 3, the channel stopper layer 4, and the high concentrationdiffusion region 12 are each made of a semiconductor material, and forma semiconductor body 30.

In this example, the EQR electrode 8 is electrically coupled to thedrain electrode 5 through the EQR contact 10 a, the channel stopperlayer 4, and the end surface 16. Accordingly, the EQR electrode 8 isheld equipotential to the drain electrode 5. With this configuration, achannel stopper structure is formed.

In the semiconductor device 100, as described above, the EQR electrode 8is embedded in the interlayer insulating film 7. Further, the EQRcontact 10 a is embedded in the interlayer insulating film 7. That is,in the semiconductor device 100, the channel stopper structure isembedded in the interlayer insulating film 7. Hence, the EQR electrode 8and the EQR contact 10 a are not in contact with the resin deposited onthe interlayer insulating film 7.

Hence, a thermal expansion of the resin deposited on the interlayerinsulating film 7 can be reduced. Accordingly, according to thisconfiguration, short-circuiting between the electrodes can be prevented,and the displacement and peeling off of the EQR contact 10 a due to aninfluence of the thermal stress can be prevented.

Also, each EQR contact 10 a is formed in the outer area of each curvedportion 8 b of the EQR electrode, which is originally the dead space(each corner 22 of the semiconductor device 100). Hence, there is noneed to ensure an additional area for forming the EQR contacts 10 a.

Therefore, according to this configuration, the downsized semiconductordevice excellent in thermal stress resistance can be provided.

Second Embodiment

Subsequently, a semiconductor device according to a second embodimentwill be described. FIG. 4 is a plan view illustrating a structure of asemiconductor device 200 according to the second embodiment. FIG. 5 isan enlarged plan view illustrating each corner 23 of the semiconductordevice 200 according to the second embodiment. As illustrated in FIGS. 4and 5, in the semiconductor device 200, the EQR contact 10 a of thesemiconductor device 100 is replaced with EQR contacts 10 b. The otherconfigurations of the semiconductor device 200 are identical with thosein the semiconductor device 100, and their description will be omitted.Also, a cross-sectional structure of the semiconductor device 200 isidentical with the cross-sectional structure of the semiconductor device100 illustrated in FIG. 3, and therefore its description will beomitted.

At each corner 23, the EQR contacts 10 b extend in a direction normal tothe outer side of the EQR electrode 8. Each EQR contact 10 b is formedin a rectangular shape, and each long side extends along a normaldirection of the EQR electrode 8. A plurality of the EQR contacts 10 bis formed in parallel.

In FIGS. 4 and 5, the EQR electrode 8 and the EQR contact 10 b arecovered with the interlayer insulating film 7. However, for descriptionof the positions of the EQR electrode 8 and the EQR contacts 10 b, theinterlayer insulating film 7 is omitted from FIGS. 4 and 5.

According to this configuration, the EQR contacts 10 b are formed ateach corner. Hence, as compared with a case in which only one EQRcontact is formed, a margin for formation defect of the EQR contacts canbe ensured. That is, even if the formation defect occurs in a part ofthe EQR contacts, the normally formed EQR contacts can function as theEQR contact.

Also, if a width of each strip electrode configuring the EQR contact 10b is narrowed, the EQR contact 10 b can be made of the same material asthat of a trench source contact 15 formed in each transistor cell in theactive area. With miniaturization of the transistor cell, when the widthof the trench source contact 15 is narrowed (for example, 0.8 μm),aluminum cannot be embedded. Hence, for example, a material excellent inthe embedding property such as tungsten is used. The width of the EQRcontact 10 b may be set to such a width that the conductive material tobe embedded is sufficiently satisfactorily embedded.

With an improvement of the embedding property, in formation of the EQRcontact 10 b by etching back after the metal has been deposited, thethickness of the EQR contact 10 b can be sufficiently ensured. Inaddition, with the narrowed width of the strip electrode, the thermalstress exerted by the resin deposited on the interlayer insulating film7 in a post-process can be further reduced.

Third Embodiment

A semiconductor device according to a third embodiment will be describedbelow. FIG. 6 is a plan view illustrating a structure of a semiconductordevice 300 according to a third embodiment. FIG. 7 is an enlarged planview illustrating each corner 24 of the semiconductor device 300according to the third embodiment. As illustrated in FIGS. 6 and 7, inthe semiconductor device 300, the EQR contact 10 a of the semiconductordevice 100 is replaced with an EQR contact 10 c. The otherconfigurations of the semiconductor device 300 are identical with thosein the semiconductor device 100, and their description will be omitted.

In FIGS. 6 and 7, the EQR electrode 8 is covered with the interlayerinsulating film 7. However, for description of the position of the EQRelectrode 8, the interlayer insulating film 7 is omitted from FIGS. 6and 7.

A cross-sectional structure of each corner in the semiconductor device300 will be described below. FIG. 8 is a cross-sectional viewillustrating the semiconductor device 300 taken along a line VIII-VIIIin FIG. 6 according to the third embodiment. As compared with the EQRcontact 10 a of the semiconductor device 100, each EQR contact 10 c isexposed without an upper portion thereof being covered with theinterlayer insulating film 7. Also, side walls of the EQR contact 10 care in contact with the interlayer insulating film 7 and the EQRelectrode 8. The other cross-sectional structures of the semiconductordevice 300 are identical with those of the semiconductor device 100, andtherefore, their description will be omitted.

A cross-sectional structure of each cell disposed in the active area 21of the semiconductor device 300 will be described below. FIG. 9 is across-sectional view illustrating the active area 21 of thesemiconductor device 300 according to the third embodiment. Each cell inthe active area 21 is of a trench gate structure.

In the active area 21, the epitaxial layer 2 is formed on thesemiconductor layer 1. The drain electrode 5 is formed on a rear surfaceside of the semiconductor layer 1. The base diffusion region 3 and asource diffusion region 4 a are formed in an upper portion of theepitaxial layer 2 in order. In this example, the source diffusion region4 a is the same layer as the channel stopper layer 4. The first gateelectrode 9 penetrates through the base diffusion region 3 and thesource diffusion region 4 a, and reaches the epitaxial layer 2. A gateoxide film 14 is formed between the base diffusion region 3, the sourcediffusion region 4 a, and the epitaxial layer 2, and the first gateelectrode 9. In FIG. 9, although not shown, the first gate electrode 9extends to the outside of the active area 21, and is electricallycoupled to the second gate electrode 6. The interlayer insulating film 7covering those structures is formed.

The high concentration diffusion region 12 is formed in an upper portionof the base diffusion region 3 in an area sandwiched by the first gateelectrode 9. The trench source contact 15 penetrates the interlayerinsulating film 7 and the source diffusion region 4 a, and iselectrically coupled to the high concentration diffusion region 12. Asource electrode 13 is formed over the interlayer insulating film 7 andthe trench source contact 15. The source electrode 13 and the trenchsource contact 15 are electrically coupled to each other.

A method of manufacturing the semiconductor device 300 will be describedbelow. FIGS. 10A1 to 10E2 are cross-sectional views illustrating aprocess of manufacturing the semiconductor device 300 according to thethird embodiment. In FIGS. 10A1 to 10E2, cross-sectional structures ofthe active area and the corner disposed in the active area 21 areillustrated side by side.

First, the epitaxial layer 2 is formed on the semiconductor layer 1.Then, the base diffusion region 3, the channel stopper layer 4, and thesource diffusion region 4 a are formed in an upper portion of theepitaxial layer 2 in the stated order. The base diffusion region 3, thechannel stopper layer 4, and the source diffusion region 4 a can berespectively formed by, for example, forming a resist mask (not shown)over the epitaxial layer 2, and thereafter implanting ions therein.Then, in the active area 21, the first gate electrode 9, the gate oxidefilm 14, and the interlayer insulating film 7 are formed as in FIG.10A1. The EQR electrode 8 embedded in the interlayer insulating film 7is formed at each corner (FIG. 10A2).

Subsequently, a resist mask 17 is formed over the interlayer insulatingfilm 7. The resist mask 17 is formed through, for example,photolithography. In the resist mask 17, an opening portion is formed inan area where the trench source contact 15 in the active area 21 isformed in the interlayer insulating film 7, and an area where the EQRcontact 10 a at the corner is simultaneously formed. Then, etching isconducted with the use of the resist mask 17 to remove the sourcediffusion region 4 a (FIG. 10B1) and the channel stopper layer 4 (FIG.10B2). In this situation, etching is executed so that the base diffusionregion 3 is not pierced.

Subsequently, the high concentration diffusion region 12 is formed in anupper portion of the base diffusion region. The high concentrationdiffusion region 12 is formed by, for example, implanting p type dopantions such as boron. The ion implantation is conducted under theconditions in which the dose is 3×10¹⁶ ions/cm², and an implant energyis 50 keV. Then, after the formation of the high concentration diffusionregion 12, the resist mask 17 is removed (FIGS. 10C1 and 10C2).

Subsequently, a tungsten layer 18 is deposited so that the openingportion is filled with the tungsten layer 18 (FIGS. 10D1 and 10D2). Abarrier metal such as titanium/titanium-nitride may well be depositedbefore depositing the tungsten layer 18. Then, the tungsten layer 18 isetched until an upper surface of the tungsten layer 18 are aligned withan upper surface of the interlayer insulating film 7 to form the trenchsource contact 15. In this situation, the tungsten layer 18 deposited atthe corner is etched in the same manner. Incidentally, the openingportion of each corner is larger in area than the opening portion of theactive area 21. For that reason, an etching rate of the opening portionof the corner is higher than that of the active area 21. As a result,the upper surface of the EQR contact 10 c at the corner is lower thanthe upper surface of the trench source contact 15 (FIGS. 10E1 and 10E2).As a result, the side surfaces of the EQR contact 10 c are formed intouch with the EQR electrode 8 and the interlayer insulating film 7, andthe upper surface of the EQR contact 10 c is lowered than that of theinterlayer insulating film 7. Thereafter, the source electrode 13 iselectrically coupled to the trench source contact 15. Thereafter, theupper surface of the EQR contact is covered with a cover film (notshown).

That is, according to this configuration and this manufacturing method,the EQR contact 10 c and the trench source contact 15 can be formed atthe same time. Hence, there is no need to add a process for forming theEQR contact 10 c. Therefore, according to this configuration and thismanufacturing method, the downsized semiconductor device excellent inthe thermal stress resistance can be realized at the low costs.

Fourth Embodiment

A semiconductor device according to a fourth embodiment will bedescribed below. FIG. 11 is a plan view illustrating a structure of asemiconductor device 400 according to a fourth embodiment. FIG. 12 is anenlarged plan view illustrating each corner 25 of the semiconductordevice 400 according to the fourth embodiment. As illustrated in FIGS.11 and 12, in the semiconductor device 400, the EQR contact 10 a of thesemiconductor device 100 is replaced with EQR contacts 10 d. The otherconfigurations of the semiconductor device 400 are identical with thosein the semiconductor device 100, and their description will be omitted.Also, a cross-sectional structure of the semiconductor device 400 isidentical with the cross-sectional structure of the semiconductor device100 illustrated in FIG. 3.

In the semiconductor device 400, the EQR contact 10 d is formed in arectangular shape. Two EQR contacts 10 d are formed at one corner. Thetwo EQR contacts 10 d are inclined in different directions with respectto a normal direction to each curved portion 8 b of the EQR electrode,respectively. Each width of those two EQR contacts 10 d is about 0.6 μm.

Other Embodiments

The present invention is not limited to the above embodiment, can beappropriately changed without departing from the subject matter of thepresent invention. For example, the EQR contacts 10 a to 10 d are notlimited to tungsten. The EQR contacts 10 a to 10 d can be made ofanother material having conductivity. Hence, the EQR contacts 10 a to 10d can be made of, for example, aluminum.

The upper surfaces of the above-mentioned EQR contacts 10 a, 10 b and 10d are covered with the interlayer insulating film 7. However, like theEQR contact 10 c, the upper surfaces of the EQR contacts 10 a, 10 b and10 d may not be covered with the interlayer insulating film 7.Accordingly, the EQR contacts 10 b and 10 d can be produced in themanufacturing process illustrated in FIGS. 10A1 to 10E2.

In the above-described first to fourth embodiments, the EQR contacts 10a to 10 d are formed over the high concentration diffusion region 12.However, if the EQR contacts 10 a to 10 d are held equipotential to thedrain electrode 5, the high concentration diffusion region 12 that is incontact with the EQR contacts 10 a to 10 d is not always required, andcan be omitted.

Also, in the above-described first to fourth embodiments, the channelstopper layer 4 is formed between the EQR contacts 10 a to 10 d and theend surface 16. The electric force line from the chip end surface can bestopped by the channel stopper layer 4. Accordingly, there can beprovided the downsize semiconductor device excellent in the reversecharacteristic and the method of manufacturing such a semiconductordevice. However, if only that the EQR contacts 10 a to 10 d are heldequipotential to the drain electrode 5, for example, through the basediffusion region 3 is targeted, the channel stopper layer 4 is notalways required, and can be omitted.

The contour of the semiconductor device according to the above-describedfirst to fourth embodiments is not limited to a rectangular shape. Thecontour of the semiconductor device according to the present inventioncan be shaped in such as an arbitrary polygon, circle or oval-shaped.

What is claimed is:
 1. A method of manufacturing a semiconductor devicewhich comprises an active area formed in a semiconductor body, thesemiconductor body having a polygonal contour, the semiconductor devicecomprising: forming an Equipotential Ring (EQR) electrode over thesemiconductor body so as to surround the active area, the EQR electrodehaving curved portions at corners of the polygonal contour; forming aninsulating film covering the semiconductor body and the EQR electrode;removing a part of the insulating film, and forming a source contacthole in the active area from which the semiconductor body is exposed,and EQR contact holes only in the curved portions of the EQR electrodefrom which the EQR electrode and the semiconductor body outside the EQRelectrode are exposed, at the same time, in which each of the EQRcontact holes has an opening larger than that of the source contacthole; depositing a conductive material on the insulating film and withinthe source contact hole and the EQR contact holes; and etching theconductive material until an upper surface of the insulating film isexposed, forming a source contact and EQR contact at the same time, inwhich an upper surface of the EQR contact is lower in level than anupper surface of the insulating film and an upper surface of the sourcecontact.
 2. The method of manufacturing a semiconductor device accordingto claim 1, wherein the EQR contact is formed at each of the curvedportions.
 3. The method of manufacturing a semiconductor deviceaccording to claim 2, wherein a plurality of the EQR contacts is formedat each of the curved portions.
 4. The method of manufacturing asemiconductor device according to claim 1, wherein the EQR contact formsa rectangular shape having a long side extended from an outer peripheryof the curved portions toward an end surface of the semiconductor body.5. The method of manufacturing a semiconductor device according to claim1, wherein the source contact and the EQR contact are configured to formtungsten plugs.
 6. The method of manufacturing a semiconductor deviceaccording to claim 1, further comprising: forming a first diffusionregion of a first conduction type and a second diffusion region of asecond conduction type on an end of the semiconductor body, wherein andthe EQR contact is in contact with the first and second diffusionregions.
 7. The method of manufacturing a semiconductor device accordingto claim 6, wherein the second diffusion region is formed above thefirst diffusion region, wherein the EQR contact holes penetrate throughthe second diffusion region, and expose the first diffusion region,wherein a bottom surface of the EQR contact is in contact with the firstdiffusion region, and wherein the second semiconductor layer is incontact with a side surface of the EQR contact.
 8. The method ofmanufacturing a semiconductor device according to claim 1, furthercomprising: forming another insulating film on the upper surface of theEQR contact.